Intel has unveiled its second-generation AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC), marking the automotive industry’s first use of a multi-process node chiplet architecture. This innovative design allows automakers to custome compute, graphics, and AI capabilities to their specific needs, enhancing scalability and cost efficiency.
Key advancements of the new SoC include:
- Up to 10x improvement in AI performance, supporting generative and multimodal AI applications.
- Up to 3x enhancement in graphics performance, enabling richer human-machine interface (HMI) experiences.
- Support for 12 camera lanes, increasing camera input and image processing capabilities.
In addition to the hardware announcement, Intel has formed strategic collaborations with automotive innovators ModelBest and Black Sesame Technologies. These partnerships aim to accelerate innovation in AI-powered cockpits, integrated advanced driver-assistance systems (ADAS), and energy-efficient vehicle compute platforms.
These developments underscore Intel’s commitment to advancing intelligent, connected vehicles through scalable performance and advanced AI capabilities.
